Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France : pbk

Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France : pbk

Material type: 図書

Author: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir

Publisher: The American Society of Mechanical Engineers

Publication date: c1998

Material Format: Paper

Capacity, size, etc.: 28 cm

NDC: -

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Note (General)：: Includes bibliographical references and index"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, Internationa...

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Paper

Material Type: 図書
ISBN: 0791818772
Title: Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France
Volume: : pbk
Author/Editor: sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Ephraim Suhir
Author Heading: Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
https://ci.nii.ac.jp/author/DA07130252
Suhir, Ephraim
https://ci.nii.ac.jp/author/DA0615640X
Publication, Distribution, etc.: The American Society of Mechanical Engineers
Publication Date: c1998
Publication Date (W3CDTF): 1998
Size: 28 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Polymers -- Mechanical properties Congresses
Integrated circuits -- Reliability Congresses
Electronic packaging -- Materials Congresses
Polymeric composites -- Testing Congresses
LCC: TK7871.15.P6
Target Audience: 一般
Note (General): Includes bibliographical references and index
"In cooperation with IEEE Components, Packaging, and Manufacturing Technology(CPMT) Society, International Microelectronics and Packaging Society(IMAPS), Society of Plastics Engineering(SPE), The Association française de mecanique(AFM)
Related Material: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Related Material (URI): https://ci.nii.ac.jp/ncid/BA48127128#entity
https://lccn.loc.gov/98074670
Periodical Title: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA48127128 : BA48127128
LC Control Number: 98074670
https://lccn.loc.gov/98074670