Electronic packaging and interconnection series

Material type: 図書

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Publisher: McGraw-Hill

Publication date: -

Material Format: Paper

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Hybrid microelectronics handbook Chip scale package (CSP) : design, materials, processes, reliability, and applications Wire bonding in microelectronics : materials, processes, reliability, and yield Plastics for electronics : materials, properties, and design applications Electronic packaging and interconnection handbook Electronic connector handbook : theory and applications Electronic assembly fabrication : chips, circuit boards, packages, and components Inside SPICE Electronic packaging, microelectronics, and interconnection dictionary Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies Ball grid array technology Electronic materials and processes handbook Printed circuit board materials handbook Thin film technology handbook Electronic packaging and interconnection handbook

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Paper

Material Type: 図書
Title: Electronic packaging and interconnection series
Publication, Distribution, etc.: McGraw-Hill
Place of Publication (Country Code): us
Target Audience: 一般
Related Material: Hybrid microelectronics handbook
https://cir.nii.ac.jp/crid/1130000794185222528
Chip scale package (CSP) : design, materials, processes, reliability, and applications
https://cir.nii.ac.jp/crid/1130000794809065600
Wire bonding in microelectronics : materials, processes, reliability, and yield
https://cir.nii.ac.jp/crid/1130000795024070784
Plastics for electronics : materials, properties, and design applications
https://cir.nii.ac.jp/crid/1130000795297947776
Electronic packaging and interconnection handbook
https://cir.nii.ac.jp/crid/1130000795583403136
Electronic connector handbook : theory and applications
https://cir.nii.ac.jp/crid/1130000795824360192
Electronic assembly fabrication : chips, circuit boards, packages, and components
https://cir.nii.ac.jp/crid/1130000795889932160
Inside SPICE
https://cir.nii.ac.jp/crid/1130000796087490048
Electronic packaging, microelectronics, and interconnection dictionary
https://cir.nii.ac.jp/crid/1130000796681939840
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
https://cir.nii.ac.jp/crid/1130000797481002240
Ball grid array technology
https://cir.nii.ac.jp/crid/1130282269157235712
Electronic materials and processes handbook
https://cir.nii.ac.jp/crid/1130282270490733824
Printed circuit board materials handbook
https://cir.nii.ac.jp/crid/1130282270631373440
Thin film technology handbook
https://cir.nii.ac.jp/crid/1130282271803233792
Electronic packaging and interconnection handbook
https://cir.nii.ac.jp/crid/1130282273304781056
Related Material (URI): https://ci.nii.ac.jp/ncid/BA23068517#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA23068517 : BA23068517