図書

2006 proceedings : Ereventh International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC) : February 21-23, 2006, Fremont Marriott Hotel, Fremont, CA

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2006 proceedings : Ereventh International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC) : February 21-23, 2006, Fremont Marriott Hotel, Fremont, CA

Material type
図書
Author
a specialty conference of 2006 Microelectronics Institute Inter on-chip Connection
Publisher
IMIC Headquarters?
Publication date
2006]
Material Format
Paper
Capacity, size, etc.
28 cm
NDC
-
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Notes on use

Note (General):

"Library of Congress No. 89-644090."Includes bibliographical referencesCMP-MIC Catalog No. 06 IMIC-1000P

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Paper

Material Type
図書
Author/Editor
a specialty conference of 2006 Microelectronics Institute Inter on-chip Connection
Publication, Distribution, etc.
Publication Date
2006]
Publication Date (W3CDTF)
2006
Size
28 cm
Alternative Title
International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC)
11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference
Place of Publication (Country Code)
us