Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii v. 1 v. 2

Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii v. 1

Material type: 図書

Author: sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama

Publisher: American Society of Mechanical Engineers

Publication date: c1995

Material Format: Paper

Capacity, size, etc.: 28 cm

NDC: -

View All

Related materials as well as pre- and post-revision versions

EEP

Search by Bookstore

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

List of Cooperating Institutions and Databases

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Paper
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type: 図書
ISBN: 0791813037
Title: Advances in electronic packaging 1995 : proceedings of the International Intersociety Electronic Packaging Conference - INTERpack '95 : presented at the International Intersociety Electronic Packaging Conference, March 26-30, 1995, Lahaina, Maui, Hawaii
Volume: v. 1
v. 2
Author/Editor: sponsored by the Electrical and Electronic Packaging Division, ASME, the Japan Society of Mechanical Engineers ; edited by Tai Ran Hsu, Avram Bar-Cohen, Wataru Nakayama
Author Heading: International Intersociety Electronic Packaging Conference
https://ci.nii.ac.jp/author/DA10368809
Hsu, Tai-Ran
https://ci.nii.ac.jp/author/DA00587409
Bar-Cohen, Avram
https://ci.nii.ac.jp/author/DA00453526
中山, 恒ナカヤマ, ワタル
https://ci.nii.ac.jp/author/DA01594782
American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
https://ci.nii.ac.jp/author/DA07130252
日本機械学会ニホンキカイガッカイ
https://ci.nii.ac.jp/author/DA00039618
Publication, Distribution, etc.: American Society of Mechanical Engineers
Publication Date: c1995
Publication Date (W3CDTF): 1995
Size: 28 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Electronic packaging -- Congresses
LCC: TK7870.15
Target Audience: 一般
Related Material: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Related Material (URI): https://ci.nii.ac.jp/ncid/BA25588518#entity
Periodical Title: EEP
https://cir.nii.ac.jp/crid/1130000795098904960
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA25588518 : BA25588518