Finite element analysis of nonlinear deformation mechanisms in semiconductor packages

Notes on use

Note (General)：: Facsim. reprint of the author's thesis (Ph.D.)--Graduate and Research Committee of Lehigh UniversityBibliography: p. 246-255UMI Number: 9955139

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Material Type: 図書
Title: Finite element analysis of nonlinear deformation mechanisms in semiconductor packages
Author/Editor: by Ali Osman Ayhan
Author Heading: Ayhan, Ali Osman
Publication, Distribution, etc.: UMI Dissertation Services
Publication Date: 1999
Publication Date (W3CDTF): 1999
Size: 23 cm
Place of Publication (Country Code): us
Text Language Code: en
Target Audience: 一般
Note (General): Facsim. reprint of the author's thesis (Ph.D.)--Graduate and Research Committee of Lehigh University
Bibliography: p. 246-255
UMI Number: 9955139
Related Material (URI): https://ci.nii.ac.jp/ncid/BA61338842#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA61338842 : BA61338842