1994 proceedings : Sixth annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA : soft. : case. : micro.

1994 proceedings : Sixth annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA : soft.

Author: sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury

Notes on use

Note (General)：: Includes bibliographical references and index"IEEE Catalog Number 94CH3412-4"

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Material Type: 図書
ISBN: 0780318498
0780318501
078031851X
Title: 1994 proceedings : Sixth annual IEEE International Conference on Wafer Scale Integration, San Francisco, California, USA
Volume: : soft.
: case.
: micro.
Author/Editor: sponsored by IEEE Computer Society, IEEE Components, Packaging, & Manufacturing Technology Society ; edited by R. Mike Lea and Stuart Tewksbury
Author Heading: IEEE International Conference on Wafer Scale Integration
Lea, R. Mike
Tewksbury, Stuart
IEEE Computer Society
https://ci.nii.ac.jp/author/DA00479199
IEEE Components, Packaging, & Manufacturing Technology Society
Publication, Distribution, etc.: IEEE Computer Society Press
Publication Date: c1994
Publication Date (W3CDTF): 1994
Size: 24 cm
Alternative Title: 94CH34124
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Integrated circuits -- Wafer scale integration -- Congresses
LCC: TK7874
Target Audience: 一般
Note (General): Includes bibliographical references and index
"IEEE Catalog Number 94CH3412-4"
Related Material (URI): https://ci.nii.ac.jp/ncid/BA22623849#entity
https://lccn.loc.gov/92054780
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA22623849 : BA22623849
LC Control Number: 92054780
https://lccn.loc.gov/92054780