図書

Advances in CMP/polishing technologies for the manufacture of electronic devices : hbk

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Advances in CMP/polishing technologies for the manufacture of electronic devices : hbk

Material type
図書
Author
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
Publisher
William Andrew : Elsevier
Publication date
2012
Material Format
Paper
Capacity, size, etc.
24 cm
NDC
-
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Notes on use

Note (General):

On title page: "William Andrew is an imprint of Elsevier"Includes bibliographical references and index

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Paper

Material Type
図書
ISBN
9781437778595
Volume
: hbk
Author/Editor
edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa
Publication, Distribution, etc.
Publication Date
2012
Publication Date (W3CDTF)
2012
Size
24 cm