International conference on wafer scale integration : proceedings, San Francisco, California, USA : case : micro

International conference on wafer scale integration : proceedings, San Francisco, California, USA : case

Author: sponosreseored by IEEE Computer Society, IEEE Components, Hybrids, and Manufacuturing Technology Society ; edited by Vijay K. Jain and Peter W. Wyatt

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Material Type: 図書
ISBN: 0818624825
0818624817
Title: International conference on wafer scale integration : proceedings, San Francisco, California, USA
Volume: : case
: micro
Author/Editor: sponosreseored by IEEE Computer Society, IEEE Components, Hybrids, and Manufacuturing Technology Society ; edited by Vijay K. Jain and Peter W. Wyatt
Author Heading: International Conference on Wafer Scale Integration
IEEE Computer Society
https://ci.nii.ac.jp/author/DA00479199
IEEE Components, Hybrids, and Manufacturing Technology Society
https://ci.nii.ac.jp/author/DA03215284
Jain, Vijay K.
https://ci.nii.ac.jp/author/DA06376122
Wyatt, Peter W.
Publication, Distribution, etc.: IEEE Computer Society Press
Publication Date: 1992
Publication Date (W3CDTF): 1992
Size: 24 cm
Alternative Title: 92CH30882
Place of Publication (Country Code): us
Text Language Code: en
Target Audience: 一般
Note (General): "IEEE catalog number 92CH3088-2."
Includes index
Related Material (URI): https://ci.nii.ac.jp/ncid/BA17242835#entity
https://lccn.loc.gov/91075442
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA17242835 : BA17242835
LC Control Number: 91075442
https://lccn.loc.gov/91075442