Creep and fracture of engineering materials and structures : proceedings of the 8th International Conference on Creep and Fracture of Engineering Materials and Structures, held in Tsukuba, Japan, November 1-5, 1999

Creep and fracture of engineering materials and structures : proceedings of the 8th International Conference on Creep and Fracture of Engineering Materials and Structures, held in Tsukuba, Japan, November 1-5, 1999

Material type: 図書

Author: Editors: T. Sakuma and K. Yagi

Publisher: Trans Tech Publications

Publication date: c2000

Material Format: Paper

Capacity, size, etc.: 25 cm

NDC: -

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Notes on use

Note (General)：: Includes bibliographical references and index

Related materials as well as pre- and post-revision versions

Key engineering materials

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Paper

Material Type: 図書
ISBN: 0878498427
Title: Creep and fracture of engineering materials and structures : proceedings of the 8th International Conference on Creep and Fracture of Engineering Materials and Structures, held in Tsukuba, Japan, November 1-5, 1999
Author/Editor: Editors: T. Sakuma and K. Yagi
Author Heading: International Conference on Creep and Fracture of Engineering Materials and Structures
https://ci.nii.ac.jp/author/DA0202311X
Sakuma, T.
Yagi, K.
Publication, Distribution, etc.: Trans Tech Publications
Publication Date: c2000
Publication Date (W3CDTF): 2000
Size: 25 cm
Place of Publication (Country Code): sz
Text Language Code: en
Subject Heading: Materials -- Creep -- Congresses
Fracture mechanics -- Congresses
LCC: TA418.22
Target Audience: 一般
Note (General): Includes bibliographical references and index
Related Material: Key engineering materials
https://cir.nii.ac.jp/crid/1130282272889284224
Related Material (URI): https://ci.nii.ac.jp/ncid/BB1663885X#entity
https://lccn.loc.gov/2003278896
Periodical Title: Key engineering materials
https://cir.nii.ac.jp/crid/1130282272889284224
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB1663885X : BB1663885X
LC Control Number: 2003278896
https://lccn.loc.gov/2003278896