The joint symposium of 7th International Symposium on Medical, Bio- and Nano-Electronics, 4th International Workshop on Nanostructures & Nanoelectronics, and JSPS Core-to-Core program joint seminar "Atomically Controlled Processing for Ultralarge Scale Integration", March 7-8, 2013

The joint symposium of 7th International Symposium on Medical, Bio- and Nano-Electronics, 4th International Workshop on Nanostructures & Nanoelectronics, and JSPS Core-to-Core program joint seminar "Atomically Controlled Processing for Ultralarge Scale Integration", March 7-8, 2013

Material type: 図書

Author: 東北大学電気通信研究所ほか

Publisher: Research Institute of Electrical Communication, Tohoku University

Publication date: [2013]

Material Format: Paper

Capacity, size, etc.: 30 cm

NDC: -

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Notes on use

Note (General)：: Site: Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University

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Paper

Material Type: 図書
Title: The joint symposium of 7th International Symposium on Medical, Bio- and Nano-Electronics, 4th International Workshop on Nanostructures & Nanoelectronics, and JSPS Core-to-Core program joint seminar "Atomically Controlled Processing for Ultralarge Scale Integration", March 7-8, 2013
Author Heading: 東北大学電気通信研究所トウホクダイガクデンキツウシンケンキュウジョ
https://ci.nii.ac.jp/author/DA02197711
文部科学省モンブカガクショウ
https://ci.nii.ac.jp/author/DA12938792
日本学術振興会ニホンガクジュツシンコウカイ
https://ci.nii.ac.jp/author/DA00108721
Publication, Distribution, etc.: Research Institute of Electrical Communication, Tohoku University
Publication Date: [2013]
Publication Date (W3CDTF): 2013
Size: 30 cm
Place of Publication (Country Code): ja
Text Language Code: en
Target Audience: 一般
Note (General): Site: Laboratory for Nanoelectronics and Spintronics, Research Institute of Electrical Communication, Tohoku University
Related Material (URI): https://ci.nii.ac.jp/ncid/BB26862226#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB26862226 : BB26862226