研磨パッドの非線形粘弾性を考慮したCMPプロセスのEHL解析

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Material Type: 図書
Title: 研磨パッドの非線形粘弾性を考慮したCMPプロセスのEHL解析
Title Transcription: ケンマパッドノヒセンケイネンダンセイオコウリョシタ CMP プロセスノ EHL カイセキ
Author/Editor: 橋本洋平 [著]
Author Heading: 橋本, 洋平ハシモト, ヨウヘイ
Publication, Distribution, etc.: [出版者不明]
Publication Date: [2013]
Publication Date (W3CDTF): 2013
Size: 30cm
Text Language Code: ja
Target Audience: 一般
Note (General): 名古屋大学大学院工学研究科2012年度博士論文
学位の種類: 博士(工学)
学位授与年月日: 2013-03-25
報告番号: 甲第10197号
学位記番号: 工博第2655号
Related Material (URI): https://ci.nii.ac.jp/ncid/BB12570823#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB12570823 : BB12570823