2005 proceedings, 55th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA : set

Author: sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance

Notes on use

Note (General)：: Includes bibliographical references and index"IEEE catalog number 05CH37635" -- Coverv. 1: xxvi, p.1-1070, v. 2: xxi, p.1071-1949

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Material Type: 図書
ISBN: 0780389069
Title: 2005 proceedings, 55th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA
Volume: : set
Author/Editor: sponsored jointly by the Components, Packaging, and Manufacturing Technology (CPMT) Society of the IEEE and the Electronic Components, Assemblies & Materials Association (ECA), the Electronic Components Sector of the Electronic Industries Alliance
Author Heading: Electronic Components & Technology Conference
https://ci.nii.ac.jp/author/DA10208697
Components, Packaging & Manufacturing Technology Society
https://ci.nii.ac.jp/author/DA08354018
Electronic Components, Assemblies & Materials Association
Electronic Industries Alliance. Electronic Components Sector
Publication, Distribution, etc.: Institute of Electrical and Electronics Engineers
Publication Date: c2005
Publication Date (W3CDTF): 2005
Size: 28 cm
Alternative Title: ECTC
05CH37635
Place of Publication (Country Code): us
Text Language Code: en
Target Audience: 一般
Note (General): Includes bibliographical references and index
"IEEE catalog number 05CH37635" -- Cover
v. 1: xxvi, p.1-1070, v. 2: xxi, p.1071-1949
Related Material (URI): https://ci.nii.ac.jp/ncid/BA73363392#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA73363392 : BA73363392