Proceedings, 1994 IEEE Hong Kong Electron Devices Meeting, July 18, 1994, the Hong Kong University of Science & Technology : soft. : micro.

Proceedings, 1994 IEEE Hong Kong Electron Devices Meeting, July 18, 1994, the Hong Kong University of Science & Technology : soft.

Author: sponsored by IEEE Electron Devices Society, the Hong Kong University of Science & Technology

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Material Type: 図書
ISBN: 0780320867
0780320875
Title: Proceedings, 1994 IEEE Hong Kong Electron Devices Meeting, July 18, 1994, the Hong Kong University of Science & Technology
Volume: : soft.
: micro.
Author/Editor: sponsored by IEEE Electron Devices Society, the Hong Kong University of Science & Technology
Author Heading: IEEE Hong Kong Electron Devices Meeting
https://ci.nii.ac.jp/author/DA10238020
IEEE Electron Devices Society
https://ci.nii.ac.jp/author/DA01257512
Hong Kong University of Science and Technology
https://ci.nii.ac.jp/author/DA10238202
Publication, Distribution, etc.: Institute of Electrical and Electronics Engineers
Publication Date: c1994
Publication Date (W3CDTF): 1994
Size: 28 cm
Place of Publication (Country Code): us
Text Language Code: en
Target Audience: 一般
Note (General): "IEEE cat. no. 94TH0704-7"
Related Material (URI): https://ci.nii.ac.jp/ncid/BA24286932#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA24286932 : BA24286932