International sympsium on interfacial joining and surface technology : solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013, November 27-29, 2013, Venue: Icho Kaikan, Osaka University, Japan

International sympsium on interfacial joining and surface technology : solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013, November 27-29, 2013, Venue: Icho Kaikan, Osaka University, Japan

Material type: 図書

Author: -

Publisher: Technical Commission on Interfacial Joining, Japan Welding Society

Publication date: 2013.11

Material Format: Paper

Capacity, size, etc.: 30 cm.

NDC: -

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Notes on use

Note (General)：: Includes bibliographical referencesOrganized by Technical Commission on Interfacial Joining, Japan Welding Society(JWS)Co-organized by Joining and Wel...

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Paper

Material Type: 図書
ISBN: 9784906110247
Title: International sympsium on interfacial joining and surface technology : solid state joining, brazing and soldering, surface treatment, advanced packaging : IJST 2013, November 27-29, 2013, Venue: Icho Kaikan, Osaka University, Japan
Publication, Distribution, etc.: Technical Commission on Interfacial Joining, Japan Welding Society
Joining and Welding Research Institute(JWRI), Osaka University
Publication Date: 2013.11
Publication Date (W3CDTF): 2013
Size: 30 cm.
Alternative Title: Proceedings of IJST 2013
Place of Publication (Country Code): ja
Text Language Code: en
Target Audience: 一般
Note (General): Includes bibliographical references
Organized by Technical Commission on Interfacial Joining, Japan Welding Society(JWS)
Co-organized by Joining and Welding Research Institute(JWRI), Osaka University, Center for Environmental Innovation Design for Sustainability(CEIDS), Osaka University
Co-operated by the The Japan Welding Engineering Society(JWES), Smart Processing Society for Materials, Environment & Energy
Related Material (URI): https://ci.nii.ac.jp/ncid/BB14216166#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB14216166 : BB14216166