図書

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

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Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.

Material type
図書
Author
editors, Ting Y. Tsui ... [et al.]
Publisher
Materials Research Society
Publication date
c2006
Material Format
Paper
Capacity, size, etc.
24 cm
NDC
-
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"... Symposium F, "Materials, Technology and Reliability of Low-k Dielectrics and Cooper Interconnects," held April 18-21 at the 2006 MRS Spring Meeti...

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Paper

Material Type
図書
Author/Editor
editors, Ting Y. Tsui ... [et al.]
Publication, Distribution, etc.
Publication Date
c2006
Publication Date (W3CDTF)
2006
Size
24 cm
Place of Publication (Country Code)
us
Text Language Code
en