マイクロプロセッサ並列処理によるランダム疲労試験法の検討

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Material Type: 図書
Title: マイクロプロセッサ並列処理によるランダム疲労試験法の検討
Title Transcription: マイクロプロセッサヘイレツショリニヨルランダムヒロウシケンホウノケントウ
Author/Editor: 研究代表者石塚鐡夫
Author Heading: 石塚, 鐡夫イシズカ, テツオ
Publication, Distribution, etc.: [横浜国立大学人間教育科学部]
Publication Date: 1998.3
Publication Date (W3CDTF): 1998
Size: 30cm
Alternative Title: 科学研究費補助金(基盤研究(B)(2))研究成果報告書 : 平成8年度-平成9年度
Place of Publication (Country Code): ja
Text Language Code: ja
Target Audience: 一般
Note (General): 課題番号: 08555244
Related Material: 科学研究費補助金(基盤研究(B)(2))研究成果報告書
https://cir.nii.ac.jp/crid/1130000796573175552
Related Material (URI): https://ci.nii.ac.jp/ncid/BA4069892X#entity
Periodical Title: 科学研究費補助金(基盤研究(B)(2))研究成果報告書
https://cir.nii.ac.jp/crid/1130000796573175552
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BA4069892X : BA4069892X