TSVを中心とするSiPの最新技術動向 = The state of art for TSV and other SiP

TSVを中心とするSiPの最新技術動向 = The state of art for TSV and other SiP

Material type: 図書

Author: 山本貴尋編著

Publisher: シーエムシー出版

Publication date: 2010.3

Material Format: Paper

Capacity, size, etc.: 27cm

NDC: 549.8

Notes on use

Note (General)：: ジャケットのシリーズ名: エレクトロニクスシリーズ文献: 章末

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Paper

Material Type: 図書
ISBN: 9784781302232
Title: TSVを中心とするSiPの最新技術動向 = The state of art for TSV and other SiP
Title Transcription: TSV オチュウシントスル SiP ノサイシンギジュツドウコウ
Author/Editor: 山本貴尋編著
Author Heading: 山本, 貴尋ヤマモト, タカヒロ
Publication, Distribution, etc.: シーエムシー出版
Publication Date: 2010.3
Publication Date (W3CDTF): 2010
Size: 27cm
Alternative Title: エレクトロニクスシリーズ
Place of Publication (Country Code): ja
Text Language Code: ja
Subject Heading: シリコン(半導体)
NDC 8th ed.: 549.8
NDC 9th ed.: 549.8 : Electronic engineering
Target Audience: 一般
Note (General): ジャケットのシリーズ名: エレクトロニクスシリーズ
文献: 章末
Related Material (URI): https://ci.nii.ac.jp/ncid/BB01512053#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB01512053 : BB01512053