Thermal conductivity 35 : Thermal expansion 23 : joint conferences, September 25-28, 2022, University of Massachusetts Lowell Inn & Conference Center, Lowell, Massachusetts USA

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Material Type: 図書
ISBN: 9781605956886
Title: Thermal conductivity 35 : Thermal expansion 23 : joint conferences, September 25-28, 2022, University of Massachusetts Lowell Inn & Conference Center, Lowell, Massachusetts USA
Author/Editor: Juergen Blumm, Marc-Antoine Thermitus
Author Heading: International Thermal Conductivity Conference
https://ci.nii.ac.jp/author/DA02480723
International Thermal Expansion Symposium
https://ci.nii.ac.jp/author/DA02481453
Blumm, Juergen
Thermitus, Marc-Antoine
Publication, Distribution, etc.: DEStech Pub.
Publication Date: c2023
Publication Date (W3CDTF): 2023
Size: 24 cm
Alternative Title: Proceedings of the Thirty-fifth International Thermal Conductivity Conference
Proceedings of the Twenty-third International Thermal Expansion Symposium
Place of Publication (Country Code): us
Text Language Code: en
Target Audience: 一般
Note (General): Includes bibliographical references and author indexes
Related Material (URI): https://ci.nii.ac.jp/ncid/BD0455036X#entity
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BD0455036X : BD0455036X