Avoiding inelastic strains in solder joint interconnections of IC devices : hbk

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Material Type: 図書
ISBN: 9781138624733
Title: Avoiding inelastic strains in solder joint interconnections of IC devices
Volume: : hbk
Author/Editor: authored by Ephraim Suhir
Author Heading: Suhir, Ephraim
Publication, Distribution, etc.: CRC Press, Taylor & Francis Group
Publication Date: 2021
Publication Date (W3CDTF): 2021
Size: 25 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Interconnects (Integrated circuit technology) -- Protection
Solder and soldering -- Mechanical properties -- Mathematical models
Failure analysis (Engineering)
LCC: TK7874.53
Target Audience: 一般
Note (General): Includes bibliographical references and index
Related Material (URI): https://ci.nii.ac.jp/ncid/BC16066924#entity
https://lccn.loc.gov/2020028727
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BC16066924 : BC16066924
LC Control Number: 2020028727
https://lccn.loc.gov/2020028727