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Joining properties and joint reliability of Si die-attached joint with Zn-Sn based high temperature lead-free solder
Joining properties and joint reliability of Si die-attached joint with Zn-Sn based high temperature lead-free solder
Paper
博士論文
Seongjun Kim [著]
[Seongjun Kim]
[2009]
<UT51-2009-C356>
National Diet Library
Author Heading
金, 声俊
マイクロエレクトロニクスシンポジウム論文集
マイクロエレクトロニクスシンポジウム論文集
Paper
Digital
雑誌
雑誌タイトル
エレクトロニクス実装学会
1985-
<Z16-1617>
National Diet Library
Volumes of this title
Zn-Sn系高温用鉛フリーはんだのダイアタッチ接合特性及び接合部信頼性
Zn-Sn系高温用鉛フリーはんだのダイアタッチ接合特性及び接合部信頼性
Digital
博士論文
金, 声俊
Available online
Other Libraries in Japan
Author Heading
金, 声俊
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