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Copper electroplating process for sub-half-micron ULSI structures UCRL-JC-119725 DE95 014674 CONF-95062061

Copper electroplating process for sub-half-micron ULSI structures UCRL-JC-119725 DE95 014674 CONF-95062061
Microform規格・テクニカルリポート類
Contolini, R. J, Tarte, L, Graff, R. T, Evans, L. B, Cox, J. N1995<LS-DE95/014674>
National Diet Library

COPPER ELECTROPLATING PROCESS FOR SUB-HALF-MICRON ULSI STRUCTURES (UCRL ; UCRL-JC-119725)

COPPER ELECTROPLATING PROCESS FOR SUB-HALF-MICRON ULSI STRUCTURES (UCRL ; UCRL-JC-119725)
Paper図書
CONTOLINI, R.J.// TARTE, L.// GRAFF, R.T.// EVANS, L.B.// COX, J.N.// PUICH, M.R.// GEE, J.D.// MU, XIAO-CHUN// CHIANG, CHIEN. (LAWRENCE LIVERMORE NATIONAL LAB., CA (UNITED STATES))University of California Research Laboratory(University of California Research Laboratory)1995.
Other Libraries in Japan
  • Author HeadingCONTOLINI, R.J. TARTE, L. GRAFF, R.T. EVANS, L.B. COX, J.N. PUICH, ...

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