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Solder flow over fine line PWB surface finishes SAND980635C DE98 007100 CONF981022

Solder flow over fine line PWB surface finishes SAND980635C DE98 007100 CONF981022
Microform規格・テクニカルリポート類
Hosking, F. M, Hernandez, C. L1998<LS-DE98/007100>
National Diet Library

Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits SAND972578C DE98 002810 CONF980422

Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits SAND972578C DE98 002810 CONF980422
Microform規格・テクニカルリポート類
Hernandez, C. L, Vianco, P. T, Rejent, J. A, Hosking, F. M1998<LS-DE98/002810>
National Diet Library

Development of a hybrid microcircuit test vehicle for surface mount applications SAND-97-0553C DE97 007794 CONF-9710281

Development of a hybrid microcircuit test vehicle for surface mount applications SAND-97-0553C DE97 007794 CONF-9710281
Microform規格・テクニカルリポート類
Hernandez, C. L, Hosking, F. M, Vianco, P. T1997<LS-DE97/007794>
National Diet Library

Use of organic solderability preservatives on solderability retention of copper after accelerated aging SAND-96-2286C DE97 002524 CONF-9703551

Use of organic solderability preservatives on solderability retention of copper after accelerated aging SAND-96-2286C DE97 002524 CONF-9703551
Microform規格・テクニカルリポート類
Hernandez, C. L, Sorensen, N. R, Lucero, S. J1997<LS-DE97/002524>
National Diet Library

Parametric study on the solderability of etched PWB copper SAND-96-2151C DE96 014501 CONF-96092123

Parametric study on the solderability of etched PWB copper SAND-96-2151C DE96 014501 CONF-96092123
Microform規格・テクニカルリポート類
Hosking, F. M, Stevenson, J. O, Hernandez, C. L1996<LS-DE96/014501>
National Diet Library

Moisture and aging effects of solder wettability of copper surfaces SAND-96-2191C DE97 000889 CONF-96101431

Moisture and aging effects of solder wettability of copper surfaces SAND-96-2191C DE97 000889 CONF-96101431
Microform規格・テクニカルリポート類
Hernandez, C. L, Sorensen, N. R, Lucero, S. J1996<LS-DE97/000889>
National Diet Library

Reduced oxide soldering activation (ROSA) PWB solderability testing SAND-96-0123 DE96 006444

Reduced oxide soldering activation (ROSA) PWB solderability testing SAND-96-0123 DE96 006444
Microform規格・テクニカルリポート類
Hernandez, C. L, Hosking, F. M, Reed, J, Tench, D. M, White, J1996<LS-DE96/006444>
National Diet Library

Effects of pre-stressing and flux on the flow of solder on PWB copper surfaces SAND-94-2593C DE95 011599 CONF-95061822

Effects of pre-stressing and flux on the flow of solder on PWB copper surfaces SAND-94-2593C DE95 011599 CONF-95061822
Microform規格・テクニカルリポート類
Hernandez, C. L, Hosking, F. M1994<LS-DE95/011599>
National Diet Library

Assessing capillary flow on printed wiring board surfaces SAND-94-1112C DE94 015768 CONF-9503441

Assessing capillary flow on printed wiring board surfaces SAND-94-1112C DE94 015768 CONF-9503441
Microform規格・テクニカルリポート類
Hosking, F. M, Yost, F. G, Hernandez, C. L, Sackinger, S. J1994<LS-DE94/015768>
National Diet Library

REDUCED OXIDE SOLDERING ACTIVATION (ROSA) PWB SOLDERABILITY TESTING (SAND ; SAND-96-0123)

REDUCED OXIDE SOLDERING ACTIVATION (ROSA) PWB SOLDERABILITY TESTING (SAND ; SAND-96-0123)
Paper図書
HERNANDEZ, C.L.// HOSKING, F.M.// REED, J.// TENCH, D.M.// WHITE, J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingHERNANDEZ, C.L. HOSKING, F.M. REED, J. TENCH,...

EFFECTS OF PRE-STRESSING AND FLUX ON THE FLOW OF SOLDER ON PWB COPPER SURFACES (SAND ; SAND-94-2593C)

EFFECTS OF PRE-STRESSING AND FLUX ON THE FLOW OF SOLDER ON PWB COPPER SURFACES (SAND ; SAND-94-2593C)
Paper図書
HERNANDEZ, C.L.// HOSKING, F.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingHERNANDEZ, C.L. HOSKING, F.M.

ASSESSING CAPILLARY FLOW ON PRINTED WIRING BOARD SURFACES (SAND ; SAND-94-1112C)

ASSESSING CAPILLARY FLOW ON PRINTED WIRING BOARD SURFACES (SAND ; SAND-94-1112C)
Paper図書
HOSKING, F.M.// YOST, F.G.// HERNANDEZ, C.L.// SACKINGER, S.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingHOSKING, F.M. YOST, F.G. HERNANDEZ, C.L. SACKINGER, S.J.

CAPILLARY FLOW SOLDERABILITY TEST FOR PRINTED WIRING BOARDS (SAND ; SAND-93-3836)

CAPILLARY FLOW SOLDERABILITY TEST FOR PRINTED WIRING BOARDS (SAND ; SAND-93-3836)
Paper図書
HOSKING, F.M.// YOST, F.G.// HERNANDEZ, C.L.// SACKINGER, S.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingHOSKING, F.M. YOST, F.G. HERNANDEZ, C.L. SACKINGER, S.J.

WETTING BEHAVIOR OF ALTERNATIVE SOLDER ALLOYS (SAND ; SAND-93-1063C)

WETTING BEHAVIOR OF ALTERNATIVE SOLDER ALLOYS (SAND ; SAND-93-1063C)
Paper図書
HOSKING, F.M.// VIANCO, P.T.// HERNANDEZ, C.L.// REJENT, J.A. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingHOSKING, F.M. VIANCO, P.T. HERNANDEZ, C.L. REJENT, J.A.

CONTROLLED ATMOSPHERE SOLDERING SYSTEM (SAND ; SAND-92-0849C)

CONTROLLED ATMOSPHERE SOLDERING SYSTEM (SAND ; SAND-92-0849C)
Paper図書
KEICHER, D.M.//HERNANDEZ, C.L.// FREAR, D.R.// HOSKING, F.M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1992.
Other Libraries in Japan
  • Author HeadingKEICHER, D.M. HERNANDEZ, C.L. FREAR, D.R. HOSKING, F.M.

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