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A unified approach to solder joint life prediction SAE-2000-01-0454

A unified approach to solder joint life prediction SAE-2000-01-0454
Paper規格・テクニカルリポート類
Qian, Zhengfang, Shi, Ling, Liu, Sheng2000<M-SAE-2000-01-0454>
National Diet Library

On MEMS packaging reliability: barriers and needs ASME-99-IMECE/EEP-23

On MEMS packaging reliability: barriers and needs ASME-99-IMECE/EEP-23
Paper規格・テクニカルリポート類
Qian, Zhengfang, Liu, Sheng1999<M-ASME-99-IMECE/EEP-23>
National Diet Library

Damage evolution measurement and simulation of the solder joint specimen ASME-99-IMECE/EEP-29

Damage evolution measurement and simulation of the solder joint specimen ASME-99-IMECE/EEP-29
Paper規格・テクニカルリポート類
Shi, Ling, Qian, Zhengfang, Liu, Sheng1999<M-ASME-99-IMECE/EEP-29>
National Diet Library

Viscoelastic behavior prediction of underfills based on two-phase composites ASME-99-IMECE/EEP-24

Viscoelastic behavior prediction of underfills based on two-phase composites ASME-99-IMECE/EEP-24
Paper規格・テクニカルリポート類
Wang, Haiying, Qian, Zhengfang, Lu, Minfu, Liu, Sheng, Wu, Jiali, Wong, C. P1999<M-ASME-99-IMECE/EEP-24>
National Diet Library

A damage coupling framework of unified viscoplasticity for the fatigue of solder alloys ASME-97-WA/EEP-8

A damage coupling framework of unified viscoplasticity for the fatigue of solder alloys ASME-97-WA/EEP-8
Paper規格・テクニカルリポート類
Qian, Zhengfang, Liu, Sheng1997<M-ASME-97-WA/EEP-8>
National Diet Library

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin YehAmerican Society of Mechanical Engineersc1998
Other Libraries in Japan
  • Author HeadingLiu, S. (Sheng) Qian, Zhengfang Yeh, Chao-pin American Societ...

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