Jump to main content

yr 〜
yr

Search results 3

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology
Paper図書
editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.World Scientific Publishing Co. Pte. Ltd.[2020]<NB141-D1>
National Diet Library
  • Author HeadingBar-Cohen, Avram, 1946- Suhling, J. C. (Jeffrey C.) Tay, Andrew A. O.

Proceedings of 2nd Electronics Packaging Technology Conferenc : [8-10 December, 1998, Raffles City Convention Center, Singapore] : soft. : case.

Proceedings of 2nd Electronics Packaging Technology Conferenc : [8-10 December, 1998, Raffles City Convention Center, Singapore] : soft. : case.
Paper図書
edited by Andrew A.O. Tay, Lim Thian Beng ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ... [et al.]IEEEc1998
Other Libraries in Japan
  • Author Heading...ogy Conference Tay, Andrew, A. O. Lim, Thiam Beng IEEE Reliabil...

Proceedings of the 1997 1st Electronic Packaging Technology Conference

Proceedings of the 1997 1st Electronic Packaging Technology Conference
Paper図書
edited by Andrew A.O. Tay ; organised by IEEE CPMT Singapore Chapter ; technically co-sponsored by IEEE CPMT Society ; sponsored by Institute of Materials Research and Engineering, Institute of MicroelectronicsInstitute of Electrical and Electronics Engineersc1997
Other Libraries in Japan
  • Author Heading...ogy Conference Tay, Andrew A. O. Components, Packaging & Manuf...

Reached to the end of result.

RSS