Encyclopedia of packaging materials, processes, and mechanics. Set 1, Interconnect and wafer bonding technology

• Material Type: 図書
• ISBN: 9789811201127 volume 1; 9811201129 volume 1; 9789811201134 volume 2; 9811201137 volume 2; 9789811201141 volume 3; 9811201145 volume 3; 9789811201158 volume 4; 9811201153 volume 4
• ISBN (set): 9811201110 set; 9789811201110 set
• Title: Encyclopedia of packaging materials, processes, and mechanics.
• Volume: Set 1
• Part Title: Interconnect and wafer bonding technology
• Author/Editor: editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.
• Author Heading: Bar-Cohen, Avram, 1946-; Suhling, J. C. (Jeffrey C.); Tay, Andrew A. O.
• Publication, Distribution, etc.: Singapore : World Scientific Publishing Co. Pte. Ltd. (出版)
• Publication Date: [2020]
• Publication Date (W3CDTF): 2019
• Extent: 4 volumes
• Other physical details: illustrations
• Size: 25 cm
• Place of Publication (Country Code): SG
• Text Language Code: eng
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Packaging.
• NDLC: NB141
• Target Audience: 一般
• Note (Bibliography): Includes bibliographical references and index.
• Holding library: 国立国会図書館
• Call No.: NB141-D1
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 030047583; http://id.ndl.go.jp/bib/030047583
• LC Control Number: 2018278368; https://lccn.loc.gov/2018278368
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 211

• Contents: Volume 1. Flip-chip and underfill materials and technologyVolume 2. Wire bonding technologyVolume 3. Flexible chip I/O interconnects...