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Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies SAND-96-0455C DE96 006464 CONF-96051012

Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies SAND-96-0455C DE96 006464 CONF-96051012
Microform規格・テクニカルリポート類
Vianco, P, Rejent, J, Artaki, I, Ray, U, Finley, D1996<LS-DE96/006464>
National Diet Library

Assessment of NiPd finished components for surface mount assembly applications SAND-95-1639C DE95 015774 CONF-95081402

Assessment of NiPd finished components for surface mount assembly applications SAND-95-1639C DE95 015774 CONF-95081402
Microform規格・テクニカルリポート類
Finley, D. W, Ray, U, Artaki, I, Vianco, P, Shah, S1995<LS-DE95/015774>
National Diet Library

COMPATIBILITY OF LEAD-FREE SOLDERS WITH LEAD CONTAINING SURFACE FINISHES AS A RELIABILITY ISSUE IN ELECTRONIC ASSEMBLIES (SAND ; SAND-96-0455C)

COMPATIBILITY OF LEAD-FREE SOLDERS WITH LEAD CONTAINING SURFACE FINISHES AS A RELIABILITY ISSUE IN ELECTRONIC ASSEMBLIES (SAND ; SAND-96-0455C)
Paper図書
VIANCO, P.// REJENT, J.// ARTAKI, I.// RAY, U.// FINLEY, D.// JACKSON, A. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingVIANCO, P. REJENT, J. ARTAKI, I. RAY, U....

ASSESSMENT OF NIPD FINISHED COMPONENTS FOR SURFACE MOUNT ASSEMBLY APPLICATIONS (SAND ; SAND-95-1639C)

ASSESSMENT OF NIPD FINISHED COMPONENTS FOR SURFACE MOUNT ASSEMBLY APPLICATIONS (SAND ; SAND-95-1639C)
Paper図書
FINLEY, D.W.// RAY, U.// ARTAKI, I.// VIANCO, P.// SHAH, S.// REYES, A.// HAQ, M. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingFINLEY, D.W. RAY, U. ARTAKI, I. VIANCO, P. SHAH, S. REYES, A. HAQ, M.

Prototype circuit boards assembled with non-lead bearing solders SAND980827C DE98 005041 CONF980716

Prototype circuit boards assembled with non-lead bearing solders SAND980827C DE98 005041 CONF980716
Microform規格・テクニカルリポート類
Vianco, P. T, Rejent, J. A1998<LS-DE98/005041>
National Diet Library

Capillary flow solder wettability test SAND-96-0029C DE96 004581 CONF-9602512

Capillary flow solder wettability test SAND-96-0029C DE96 004581 CONF-9602512
Microform規格・テクニカルリポート類
Vianco, P. T, Rejent, J. A1996<LS-DE96/004581>
National Diet Library

Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits SAND972578C DE98 002810 CONF980422

Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits SAND972578C DE98 002810 CONF980422
Microform規格・テクニカルリポート類
Hernandez, C. L, Vianco, P. T, Rejent, J. A, Hosking, F. M1998<LS-DE98/002810>
National Diet Library

Development of a hybrid microcircuit test vehicle for surface mount applications SAND-97-0553C DE97 007794 CONF-9710281

Development of a hybrid microcircuit test vehicle for surface mount applications SAND-97-0553C DE97 007794 CONF-9710281
Microform規格・テクニカルリポート類
Hernandez, C. L, Hosking, F. M, Vianco, P. T1997<LS-DE97/007794>
National Diet Library

Model-based predictions of solid state intermetallic compound layer growth in hybrid microelectronic circuits SAND-97-3049C DE98 001488 CONF-971193

Model-based predictions of solid state intermetallic compound layer growth in hybrid microelectronic circuits SAND-97-3049C DE98 001488 CONF-971193
Microform規格・テクニカルリポート類
Vianco, P. T, Erickson, K. L, Hopkins, P. L1997<LS-DE98/001488>
National Diet Library

Evaluation of prototype surface mount circuit boards assembled with three non-lead bearing solders SAND-95-1367C DE95 014889 CONF-95081403

Evaluation of prototype surface mount circuit boards assembled with three non-lead bearing solders SAND-95-1367C DE95 014889 CONF-95081403
Microform規格・テクニカルリポート類
Vianco, P. T, May, C1995<LS-DE95/014889>
National Diet Library

Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819

Effects of microstructural heterogeneity on BGA reliability SAND981649C DE98 003973 CONF980819
Microform規格・テクニカルリポート類
Neilsen, M. K, Burchett, S. N, Fang, H. E, Vianco, P. T1998<LS-DE98/003973>
National Diet Library

Ultraminiature resonator accelerometer SAND-96-0971 DE96 010913

Ultraminiature resonator accelerometer SAND-96-0971 DE96 010913
Microform規格・テクニカルリポート類
Koehler, D. R, Kravitz, S. H, Vianco, P. T1996<LS-DE96/010913>
National Diet Library

Intermetallic compound layer growth kinetics in non-lead bearing solders SAND-95-0573C DE95 009595 CONF-95031192

Intermetallic compound layer growth kinetics in non-lead bearing solders SAND-95-0573C DE95 009595 CONF-95031192
Microform規格・テクニカルリポート類
Vianco, P. T, Kilgo, A. C, Grant, R1995<LS-DE95/009595>
National Diet Library

Development of lead-free solders for hybrid microcircuits SAND-96-0062C DE96 004707 CONF-95111661

Development of lead-free solders for hybrid microcircuits SAND-96-0062C DE96 004707 CONF-95111661
Microform規格・テクニカルリポート類
Hosking, F. M, Vianco, P. T, Frear, D. R, Robinson, D. G1996<LS-DE96/004707>
National Diet Library

Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system SAND-96-0951C DE97 000662 CONF-9702017

Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system SAND-96-0951C DE97 000662 CONF-9702017
Microform規格・テクニカルリポート類
Vianco, P. T, Hopkins, P. L, Erickson, K. L, Frear, D. R, Davidson, R1996<LS-DE97/000662>
National Diet Library

Analysis of physiochemical processes during solder aging SAND-94-0691 DE95 003811

Analysis of physiochemical processes during solder aging SAND-94-0691 DE95 003811
Microform規格・テクニカルリポート類
Erickson, K. L, Hopkins, P. L, Vianco, P. T1994<LS-DE95/003811>
National Diet Library

Wave soldering with Pb-free solders SAND-95-1372C DE95 014888 CONF-95081404

Wave soldering with Pb-free solders SAND-95-1372C DE95 014888 CONF-95081404
Microform規格・テクニカルリポート類
Artaki, I, Finley, D. W, Jackson, A. M, Ray, U, Vianco, P. T1995<LS-DE95/014888>
National Diet Library

CAPILLARY FLOW SOLDER WETTABILITY TEST (SAND ; SAND-96-0029C)

CAPILLARY FLOW SOLDER WETTABILITY TEST (SAND ; SAND-96-0029C)
Paper図書
VIANCO, P.T.// REJENT, J.A. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1996.
Other Libraries in Japan
  • Author HeadingVIANCO, P.T. REJENT, J.A.

EVALUATION OF PROTOTYPE SURFACE MOUNT CIRCUIT BOARDS ASSEMBLED WITH THREE NON-LEAD BEARING SOLDERS (SAND ; SAND-95-1367C)

EVALUATION OF PROTOTYPE SURFACE MOUNT CIRCUIT BOARDS ASSEMBLED WITH THREE NON-LEAD BEARING SOLDERS (SAND ; SAND-95-1367C)
Paper図書
VIANCO, P.T.// MAY, C. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1995.
Other Libraries in Japan
  • Author HeadingVIANCO, P.T. MAY, C.

SOLDER TECHNOLOGY IN THE MANUFACTURING OF ELECTRONIC PRODUCTS (SAND ; SAND-93-1604C)

SOLDER TECHNOLOGY IN THE MANUFACTURING OF ELECTRONIC PRODUCTS (SAND ; SAND-93-1604C)
Paper図書
VIANCO, P.T. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingVIANCO, P.T.
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