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Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin YehAmerican Society of Mechanical Engineersc1998
Other Libraries in Japan
  • Subject Heading...ing Congresses Electronic packaging -- Materials -- Fatigue Congresses Thermal stresses Congresses D...
  • Subject Heading (ID)...ing Congresses Electronic packaging -- Materials -- Fatigue Congresses Thermal stresses Congresses D...

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