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Quality conformance and qualification of microelectronic packages and interconnects : alk. paper

Quality conformance and qualification of microelectronic packages and interconnects : alk. paper
Paper図書
edited by Michael Pecht ... [et al.]Wileyc1994
Other Libraries in Japan
  • Subject Heading...uality control Electronic packaging -- Testing Quality assurance
  • Subject Heading (ID)...uality control Electronic packaging -- Testing Quality assurance

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin YehAmerican Society of Mechanical Engineersc1998
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Testing Congresses Electronic packagi...
  • Subject Heading (ID)Electronic packaging -- Testing Congresses Electronic packagi...

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