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Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Paper
図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin Yeh
American Society of Mechanical Engineers
c1998
Other Libraries in Japan
Subject Heading
Electronic packaging -- Testing Congresses
Electronic packaging -- Mater...
Subject Heading (ID)
Electronic packaging -- Testing Congresses
Electronic packaging -- Mater...
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