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Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
Paper
図書
The American Society of Mechanical Engineers
[2019]
<M17-20-1069>
National Diet Library
Subject Heading
Electronic packaging--Congresses. Electronic packaging.
IPACK2018
Alternative Title
...microsystems :
IPACK2018
Alternative Title
...microsystems :
IPACK2018
Reached to the end of result.
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