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Food packing materials : testing & quality assurance

Food packing materials : testing & quality assurance
Paper図書
edited by Preeti Singh, Ali Abas Wani, Horst-Christian Langowski.CRC Press, Taylor & Francis Group[2017]<PC111-B35>
National Diet Library

Practical guide to chemical safety testing : regulatory consequences : chemicals, food packaging and medical devices / edited by Derek J. Knight and Mike B. Thomas.

Practical guide to chemical safety testing : regulatory consequences : chemicals, food packaging and medical devices / edited by Derek J. Knight and Mike B. Thomas.
Paper図書
Rapra Technology2003.<X>
National Diet Library
  • Subject Heading...sures. Food -- Packaging -- Testing. Medical instr......s. Plastics in packaging -- Testing. Rubber goods -- Safety measu...

Containment analysis for type B packages used to transport various contents [microform] / prepared by B.L. Anderson, R.W. Carlson, L.E. Fischer

Containment analysis for type B packages used to transport various contents [microform] / prepared by B.L. Anderson, R.W. Carlson, L.E. Fischer
Microform図書
1996<YCA-Y 3.N 88:25/6487>
National Diet Library
  • Subject HeadingPackaging -- Testing Radioactive substances -- Pac...

Improving tamper-evident packaging : problems, tests, and solutions

Improving tamper-evident packaging : problems, tests, and solutions
Paper図書
Jack L. RosetteTechnomic Pub. Co.c1992
Other Libraries in Japan
  • Subject HeadingPackaging Packaging -- Testing
  • Subject Heading (ID)Packaging Packaging -- Testing

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California

Thermo-mechanical characterization of evolving packaging materials and structures : presented at the 1998 ASME International Mechanical Engineering Congress and Exposition : November 15-20, 1998, Anaheim, California
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Sheng Liu, Zhengfang Qian, Chao-pin YehAmerican Society of Mechanical Engineersc1998
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Testing Congresses Electronic packagi...
  • Subject Heading (ID)Electronic packaging -- Testing Congresses Electronic packagi...

Quality conformance and qualification of microelectronic packages and interconnects : alk. paper

Quality conformance and qualification of microelectronic packages and interconnects : alk. paper
Paper図書
edited by Michael Pecht ... [et al.]Wileyc1994
Other Libraries in Japan
  • Subject Heading...rol Electronic packaging -- Testing Quality assurance
  • Subject Heading (ID)...rol Electronic packaging -- Testing Quality assurance

Selected ASTM standards on packaging 4th ed

Selected ASTM standards on packaging 4th ed
Paper図書
sponsored by ASTM Committee D-10 on PackagingASTM1994
Other Libraries in Japan
  • Subject Heading... United States Packaging -- Testing -- Standards -- United States
  • Subject Heading (ID)... United States Packaging -- Testing -- Standards -- United States

Packaging evaluation : the testing of filled transport packages

Packaging evaluation : the testing of filled transport packages
Paper図書
J.M. Montresor, H.P. Mostyn, and F.A. PaineNewnes-Butterworth1974
Other Libraries in Japan
  • Subject HeadingPackaging -- Testing
  • Subject Heading (ID)Packaging -- Testing

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