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Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1158)

Packaging, chip-package interactions and solder materials challenges : April 13-17, 2009 : San, [sic] Francisco, California, USA. : Apr 2009, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1158)
Paper図書
Materials Research Societyc2009.<M17-10-2183>
National Diet Library
  • Subject HeadingChip scale packaging -- Materials -- Congresses. Solder and soldering -- Congresses.

Papers on soldering, 1962, presented at the Sixty-fifth Annual Meeting, American Society for Testing and Materials, New York, N. Y., June 24, 1962. (ASTM special technical publication no. 319)

Papers on soldering, 1962, presented at the Sixty-fifth Annual Meeting, American Society for Testing and Materials, New York, N. Y., June 24, 1962. (ASTM special technical publication no. 319)
Paper図書
American Society for Testing and Materials[1963]<671-A5128p>
National Diet Library
  • Subject HeadingSolder and soldering -- Congresses.

Symposium on solder : presented at the fifty-ninth annual meeting, American Society for Testing Materials, Atlantic City, N.J., June 19-20, 1956. (ASTM special technical publication ; 189)

Symposium on solder : presented at the fifty-ninth annual meeting, American Society for Testing Materials, Atlantic City, N.J., June 19-20, 1956. (ASTM special technical publication ; 189)
Paper図書
American Society for Testing Materials1957.<671-A5128s>
National Diet Library
  • Subject HeadingSolder and soldering -- Congresses.

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