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Ｆｌｉｐ　ｃｈｉｐ　ｔｅｃｈｎｏｌｏｇｉｅｓ (Ｅｌｅｃｔｒｏｎｉｃ　ｐａｃｋａｇｉｎｇ　ａｎｄ　ｉｎｔｅｒｃｏｎｅｃｔｉｏｎ　ｓｅｒｉｅｓ)

Ｆｌｉｐ　ｃｈｉｐ　ｔｅｃｈｎｏｌｏｇｉｅｓ (Ｅｌｅｃｔｒｏｎｉｃ　ｐａｃｋａｇｉｎｇ　ａｎｄ　ｉｎｔｅｒｃｏｎｅｃｔｉｏｎ　ｓｅｒｉｅｓ)
Paper図書
ＪｏｈｎＨ．Ｌａｕ，ｅｄｉｔｏｒ．ＭｃＧｒａｗ－Ｈｉｌｌｃ１９９６．
Other Libraries in Japan
  • Title HeadingＦｌｉｐ　ｃｈｉｐ　ｔｅｃｈｎｏｌｏｇｉｅｓ

Low cost solder bumped flip chip technologies for direct chip attach (DCA) and chip scale package (CSP) : Course : May 1998, Singapore.

Low cost solder bumped flip chip technologies for direct chip attach (DCA) and chip scale package (CSP) : Course : May 1998, Singapore.
Paper図書
<M17-99-1949>
National Diet Library
  • Note (General)... solder bumped flip chip technologies ; chip scale package.
  • Alternative Title... solder bumped flip chip technologies ; chip scale package
  • Alternative Title... solder bumped flip chip technologies ; chip scale package

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