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Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin. (McGraw-Hill handbooks) (Electronic packaging and interconnection series)

Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin. (McGraw-Hill handbooks) (Electronic packaging and interconnection series)
Paper図書
McGraw-Hillc1999.<ND416-A23>
National Diet LibraryOther Libraries in Japan

Electronic packaging and interconnection handbook 4th ed

Electronic packaging and interconnection handbook 4th ed
Paper図書
Charles A. Harper, editor in chiefMcGraw-Hillc2005
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series McGraw-Hill handbooks
  • Periodical TitleElectronic packaging and interconnection series McGraw-Hill handbooks

Electronic assembly fabrication : chips, circuit boards, packages, and components

Electronic assembly fabrication : chips, circuit boards, packages, and components
Paper図書
Charles A. Harper, editor-in-chiefMcGraw-Hillc2002
Other Libraries in Japan
  • Related MaterialMcGraw-Hill professional engineering Electronic packaging and interconnection series
  • Periodical TitleMcGraw-Hill professional engineering Electronic packaging and interconnection series

Electronic packaging and interconnection handbook 3rd ed

Electronic packaging and interconnection handbook 3rd ed
Paper図書
Charles A. Harper, editor-in-chiefMcGraw-Hillc2000
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series McGraw-Hill handbooks
  • Periodical TitleElectronic packaging and interconnection series McGraw-Hill handbooks

Inside SPICE 2nd ed.

Inside SPICE 2nd ed.
Paper図書
Ron M. KielkowskiMcGraw-Hillc1998
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Thin film technology handbook : hardcover

Thin film technology handbook : hardcover
Paper図書
Aicha A.R. Elshabini-Riad, Fred D. Barlow IIIMcGraw-Hillc1998
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Electronic connector handbook : theory and applications

Electronic connector handbook : theory and applications
Paper図書
Robert S. MroczkowskiMcGraw-Hillc1998
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Chip scale package (CSP) : design, materials, processes, reliability, and applications

Chip scale package (CSP) : design, materials, processes, reliability, and applications
Paper図書
John H. Lau, Shi-Wei Ricky LeeMcGraw-Hillc1999
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed

Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed
Paper図書
George G. HarmonMcGraw-Hillc1997
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc
Paper図書
John H. Lau, Yi-Hsin PaoMcGraw-Hillc1997
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Printed circuit board materials handbook :acid-free paper

Printed circuit board materials handbook :acid-free paper
Paper図書
Martin W. Jawitz, editor in chiefMcGraw-Hill1997
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Plastics for electronics : materials, properties, and design applications

Plastics for electronics : materials, properties, and design applications
Paper図書
William M. AlvinoMcGraw-Hillc1995
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Ball grid array technology : acid-free paper

Ball grid array technology : acid-free paper
Paper図書
John H. Lau, editorMcGraw-Hillc1995
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Hybrid microelectronics handbook 2nd ed

Hybrid microelectronics handbook 2nd ed
Paper図書
[edited by] Jerry E. Sergent, Charles A. HarperMcGraw-Hillc1995
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Electronic materials and processes handbook 2nd ed

Electronic materials and processes handbook 2nd ed
Paper図書
Charles A. Harper, Ronald N. Sampson, [editors]McGraw-Hillc1994
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

Electronic packaging, microelectronics, and interconnection dictionary

Electronic packaging, microelectronics, and interconnection dictionary
Paper図書
Charles A. Harper, Martin B. MillerMcGraw-Hillc1993
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnection series
  • Periodical TitleElectronic packaging and interconnection series

High-frequency characterization of electronic packaging

High-frequency characterization of electronic packaging
Paper図書
by Luc MartensKluwer Academic Publishers1998
Other Libraries in Japan

Electronic packaging and interconnection series

Electronic packaging and interconnection series
Paper図書
McGraw-Hill
Other Libraries in Japan

Electronic packaging and interconnects series

Electronic packaging and interconnects series
Paper図書
Kluwer Academic Publishers
Other Libraries in Japan

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