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Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin. (McGraw-Hill handbooks) (Electronic packaging and interconnection series)

Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin. (McGraw-Hill handbooks) (Electronic packaging and interconnection series)
Paper図書
McGraw-Hillc1999.<ND416-A23>
National Diet LibraryOther Libraries in Japan

High-frequency characterization of electronic packaging

High-frequency characterization of electronic packaging
Paper図書
by Luc MartensKluwer Academic Publishers1998
Other Libraries in Japan
  • Related MaterialElectronic packaging and interconnects series
  • Periodical TitleElectronic packaging and interconnects series

Electronic packaging and interconnection handbook 4th ed

Electronic packaging and interconnection handbook 4th ed
Paper図書
Charles A. Harper, editor in chiefMcGraw-Hillc2005
Other Libraries in Japan

Electronic assembly fabrication : chips, circuit boards, packages, and components

Electronic assembly fabrication : chips, circuit boards, packages, and components
Paper図書
Charles A. Harper, editor-in-chiefMcGraw-Hillc2002
Other Libraries in Japan

Inside SPICE 2nd ed.

Inside SPICE 2nd ed.
Paper図書
Ron M. KielkowskiMcGraw-Hillc1998
Other Libraries in Japan

Thin film technology handbook : hardcover

Thin film technology handbook : hardcover
Paper図書
Aicha A.R. Elshabini-Riad, Fred D. Barlow IIIMcGraw-Hillc1998
Other Libraries in Japan

Electronic connector handbook : theory and applications

Electronic connector handbook : theory and applications
Paper図書
Robert S. MroczkowskiMcGraw-Hillc1998
Other Libraries in Japan

Electronic packaging and interconnection handbook 3rd ed

Electronic packaging and interconnection handbook 3rd ed
Paper図書
Charles A. Harper, editor-in-chiefMcGraw-Hillc2000
Other Libraries in Japan

Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed

Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed
Paper図書
George G. HarmonMcGraw-Hillc1997
Other Libraries in Japan

Chip scale package (CSP) : design, materials, processes, reliability, and applications

Chip scale package (CSP) : design, materials, processes, reliability, and applications
Paper図書
John H. Lau, Shi-Wei Ricky LeeMcGraw-Hillc1999
Other Libraries in Japan

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc
Paper図書
John H. Lau, Yi-Hsin PaoMcGraw-Hillc1997
Other Libraries in Japan

Printed circuit board materials handbook :acid-free paper

Printed circuit board materials handbook :acid-free paper
Paper図書
Martin W. Jawitz, editor in chiefMcGraw-Hill1997
Other Libraries in Japan

Plastics for electronics : materials, properties, and design applications

Plastics for electronics : materials, properties, and design applications
Paper図書
William M. AlvinoMcGraw-Hillc1995
Other Libraries in Japan

Ball grid array technology : acid-free paper

Ball grid array technology : acid-free paper
Paper図書
John H. Lau, editorMcGraw-Hillc1995
Other Libraries in Japan

Hybrid microelectronics handbook 2nd ed

Hybrid microelectronics handbook 2nd ed
Paper図書
[edited by] Jerry E. Sergent, Charles A. HarperMcGraw-Hillc1995
Other Libraries in Japan

Electronic packaging, microelectronics, and interconnection dictionary

Electronic packaging, microelectronics, and interconnection dictionary
Paper図書
Charles A. Harper, Martin B. MillerMcGraw-Hillc1993
Other Libraries in Japan

Electronic materials and processes handbook 2nd ed

Electronic materials and processes handbook 2nd ed
Paper図書
Charles A. Harper, Ronald N. Sampson, [editors]McGraw-Hillc1994
Other Libraries in Japan

Electronic packaging and interconnects series

Electronic packaging and interconnects series
Paper図書
Kluwer Academic Publishers
Other Libraries in Japan

Electronic packaging and interconnection series

Electronic packaging and interconnection series
Paper図書
McGraw-Hill
Other Libraries in Japan

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