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Thermoelectric Energy Conversion Devices And Systems (Wspc Series In Advanced Integration And Packaging ; vol. 7)

Thermoelectric Energy Conversion Devices And Systems (Wspc Series In Advanced Integration And Packaging ; vol. 7)
Paper図書
Kazuaki Yazawa, Je-Hyeong Bahk, Ali ShakouriWorld Scientific Publishing Company[2021]<MC131-D8>
National Diet Library
  • Title HeadingWSPC series in advanced integration and packaging ; vol. 7

Solder materials (WSPC series in advanced integration and packaging ; vol. 6)

Solder materials (WSPC series in advanced integration and packaging ; vol. 6)
Paper図書
Kwang-Lung Lin.World Scientific Publishing Co. Pte. Ltd.[2018]<PD51-B18>
National Diet Library

Solder materials

Solder materials
Paper図書
Kwang-Lung LinWorld Scientificc2018
Other Libraries in Japan
  • Related MaterialWSPC Series in Advanced Integration and Packaging
  • Periodical TitleWSPC Series in Advanced Integration and Packaging

Design and modeling for 3D ICs and interposers

Design and modeling for 3D ICs and interposers
Paper図書
Madhavan Swaminathan, Ki Jin HanWorld Scientificc2014
Other Libraries in Japan
  • Related MaterialWSPC Series in Advanced Integration and Packaging
  • Periodical TitleWSPC Series in Advanced Integration and Packaging

Cost analysis of electronic systems

Cost analysis of electronic systems
Paper図書
Peter SandbornWorld Scientificc2013
Other Libraries in Japan
  • Related MaterialWSPC Series in Advanced Integration and Packaging
  • Periodical TitleWSPC Series in Advanced Integration and Packaging

WSPC Series in Advanced Integration and Packaging

WSPC Series in Advanced Integration and Packaging
Paper図書
Series editors, Avram Bar-Cohen, Shi-Wei Ricky LeeWorld Scientific
Other Libraries in Japan

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