Solder materials (WSPC series in advanced integration and packaging ; vol. 6)

Solder materials

(WSPC series in advanced integration and packaging ; vol. 6)

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Material Type: 図書
ISBN: 9789813237605
ISSN (series): 2315-473X
Title: Solder materials
Author/Editor: Kwang-Lung Lin.
Series Title: WSPC series in advanced integration and packaging ; vol. 6
Author Heading: Lin, Kwang-lung.
Publication, Distribution, etc.: Singapore : World Scientific Publishing Co. Pte. Ltd. (出版)
Publication Date: [2018]
Publication Date (W3CDTF): 2018
Extent: xi, 375 pages
Other physical details: illustrations
Size: 24 cm.
Place of Publication (Country Code): SG
Text Language Code: eng
Content Type: text
Media Type: unmediated
Carrier Type: volume
Subject Heading: Solder and soldering.
Solder pastes.
LCC: TS610
DDC: 671.56
NDLC: PD51
Target Audience: 一般
Note (Bibliography): Includes bibliographical references and index.
Holding library: 国立国会図書館
Call No.: PD51-B18
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 029460178
http://id.ndl.go.jp/bib/029460178
LC Control Number: 2018288926
https://lccn.loc.gov/2018288926
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 211