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Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

Application of fracture mechanics in electronic packaging : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
紙図書
sponsored by the Applied Mechanics Division, ASME, the Electrical and Electronics Packaging Division, ASME ; edited by William T. Chen, David T. ReadAmerican Society of Mechanical Engineersc1997
全国の図書館
  • 一般注記...esented at the Symposium on Application of Fracture Mechanics in Electronic Packaging"--P. iii Includes bibliograph...
  • 著者標目...and Exposition Symposium on Application of Fracture Mechanics in Electronic Packaging

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