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検索結果 18 件

2014 9th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2014) : Santorini, Greece : 6-8 May 2014. CFP1493A-ART

2014 9th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2014) : Santorini, Greece : 6-8 May 2014. CFP1493A-ART
紙図書
IEEE[2014]<M17-15-2304>
国立国会図書館
  • 件名...uits--Testing. Microelectronics--Design. Nanotechnology. Systems on a ...

2013 8th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2013) : Abu Dhabi, United Arab Emirates : 26-28 March 2013.

2013 8th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2013) : Abu Dhabi, United Arab Emirates : 26-28 March 2013.
紙図書
IEEEc2013.<M17-14-334>
国立国会図書館

2011 6th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2011) : Athens, Greece : 6-8 April 2011.

2011 6th international conference on design & technology of integrated systems in nanoscale era : (DTIS 2011) : Athens, Greece : 6-8 April 2011.
紙図書
IEEEc2011.<M17-12-1288>
国立国会図書館

DTIS'09 : 2009 4th IEEE international conference on design & technology of integrated systems in nanoscale era : proceedings : April 6-7, 2009 : Four Seasons Hotel, Nile Plaza : Cairo, Egypt.

DTIS'09 : 2009 4th IEEE international conference on design & technology of integrated systems in nanoscale era : proceedings : April 6-7, 2009 : Four Seasons Hotel, Nile Plaza : Cairo, Egypt.
紙図書
IEEEc2009.<M17-10-2540>
国立国会図書館

2006 international conference on design & test integrated systems in nanoscale technology : La Marsa, Tunisia : 5-7 September 2006.

2006 international conference on design & test integrated systems in nanoscale technology : La Marsa, Tunisia : 5-7 September 2006.
紙図書
Institute of Electrical and Electronics Engineersc2006.<M17-07-2512>
国立国会図書館

Introduction to microsystem design

Introduction to microsystem design
紙図書
Werner Karl SchomburgSpringerc2011
全国の図書館

System-in-package RF design and applications

System-in-package RF design and applications
紙図書
Michael P. GaynorArtech Housec2007
全国の図書館

Benefiting from thermal and mechanical simulation in micro-electronics

Benefiting from thermal and mechanical simulation in micro-electronics
紙図書
edited by G.Q. Zhang, L.J. Ernst, O. de Saint LegerKluwer Academic Publishersc2000
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Proceedings : fourth IEEE International Symposium on Electronic Design, Test, and Applications, 23-25 January 2008, Hong Kong, SAR, China

Proceedings : fourth IEEE International Symposium on Electronic Design, Test, and Applications, 23-25 January 2008, Hong Kong, SAR, China
紙図書
editors, Adam Osseiran ... [et al.] ; sponsored by IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Hong Kong ED/SSC Joint Chapter, Hong Kong University of Science and TechnologyIEEE Computer Societyc2008
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Proceedings : third IEEE International Workshop on Electronic Design, Test, and Applications, 17-19 January 2006, Kuala Lumpur, Malaysia

Proceedings : third IEEE International Workshop on Electronic Design, Test, and Applications, 17-19 January 2006, Kuala Lumpur, Malaysia
紙図書
edited by Patrick Girard, Adam Osseiran, and Moi-Tin Chew ; sponsored by IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Malaysia Section, Monash University, Malaysia ; with industrial co-sponsorship from National Instruments ; in cooperation with Freescale Semiconductor Malaysia ... [et al.]IEEE Computer Societyc2006
全国の図書館

Fundamentals of microfabrication

Fundamentals of microfabrication
紙図書
Marc MadouCRC Pressc1997
全国の図書館

Conceptual design of multichip modules and systems

Conceptual design of multichip modules and systems
紙図書
Peter A. Sandborn, Hector MorenoKluwer Academicc1994
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Electronics packaging forum : multichip module technology issues

Electronics packaging forum : multichip module technology issues
紙図書
edited by James E. MorrisIEEE Pressc1994
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Physical design for multichip modules

Physical design for multichip modules
紙図書
by M. Sriram, S.M. KangKluwer Academic Publishersc1994
全国の図書館

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
紙図書
[edited by] Michael PechtWileyc1994
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Simulation and design of microsystems and microstructures : uk : us

Simulation and design of microsystems and microstructures : uk : us
紙図書
editors, R.A. Adey, A. Lahrmann, C. LessmölmannComputational Mechanicsc1995
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Routing in the third dimension : from VLSI chips to MCMs

Routing in the third dimension : from VLSI chips to MCMs
紙図書
Naveed A. Sherwani, Siddharth Bhingarde, Anand PanyamIEEE Pressc1995
全国の図書館

Rapid thermal and laser processing : 24-25 September 1992, San Jose, California

Rapid thermal and laser processing : 24-25 September 1992, San Jose, California
紙図書
Dim-Lee Kwong, Heinrich G. Müller, chairs/editors ; sponsored and published by SPIE--the International Society for Optical EngineeringSPIEc1993
全国の図書館

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