Chemical mechanical planarization 5 : proceedings of the international symposium. : 5th international symposium on chemical mechanical planarization (CMP) : May 2002, Philadelphia, PA.

• 資料種別: 図書
• ISBN: 1566773296
• タイトル: Chemical mechanical planarization 5 : proceedings of the international symposium. : 5th international symposium on chemical mechanical planarization (CMP) : May 2002, Philadelphia, PA.
• シリーズタイトル: PV ; 02-1
• タイトル標目: Proceedings (Electrochemical Society) ; v. 2002-1.
• 著者標目: Seal, S. (Sudipta); International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th : 2002 : Philadelphia, Pa.)
• 出版事項: Pennington : Electrochemical Society
• 出版年月日等: c2002.
• 出版年（W3CDTF）: 2002
• 数量: vii, 274 p. : ill. ; 24 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Microelectronics -- Materials -- Congresses.; Grinding and polishing -- Congresses.; Metals -- Pickling -- Congresses.; Integrated circuits -- Materials -- Congresses.
• NDLC: M17
• 一般注記: Papers.; "Proceedings of the Fifth International Symposium on Chemical Mechanical Planarization (CMP) in Integrated Circuit Device Manufacturing held at the 201st Meeting of the Electrochemical Society in Philadelphia, Pennsylvania from May 12th to 17th, 2002" -- Pref.; "Sponsoring Divisions: Dielectric Science and Technology and Electronics" -- T.p.
• 書誌注記: Includes bibliographical references and indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-03-1022
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000004097782; http://id.ndl.go.jp/bib/000004097782
• RLIN番号: CUBGGLAD184956036-B
• 整理区分コード: 215