Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. : 203rd meeting of the Electrochemical Society : Apr 2003, Paris, France.

• 資料種別: 図書
• ISBN: 1566773938
• タイトル: Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. : 203rd meeting of the Electrochemical Society : Apr 2003, Paris, France.
• シリーズタイトル: PV ; 2003-13
• タイトル標目: Proceedings (Electrochemical Society) ; v. 2003-13.
• 著者標目: Mathad, G. S.; International Symposium on Thin Film Materials, Processes, andReliability: PLasma Processing for the 100 nm Node and Copper Interconnects with Low-k Inter Level Dielectric Films (2003 : Paris, France)
• 出版事項: Pennington : Electrochemical Society
• 出版年月日等: c2003.
• 出版年（W3CDTF）: 2003
• 数量: x, 424 p. : ill. ; 24 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Thin films -- Congresses.
• NDLC: M17
• 一般注記: Papers.; "This proceedings volume contains the papers presented at the International Symposium on Thin Film Materials, Processes, and Reliability: Plasma Processing for the 100 nm node and Copper Interconnects with Low-k Inter Level Dielectric Films. The symposium, (...) was held as part of the 203rd Meeting of The Electrochemical Society, Inc., in Paris, France, April 27-May 2, 2003." -- p. iii.
• 書誌注記: Includes bibliographical references and indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-04-2092
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000007340136; http://id.ndl.go.jp/bib/000007340136
• LC control number: 2003109518; https://lccn.loc.gov/2003109518
• RLIN番号: CSUGA5563776-B
• 整理区分コード: 215