Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. : 203rd meeting of the Electrochemical Society : Apr 2003, Paris, France. (PV ; 2003-13)

Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. : 203rd meeting of the Electrochemical Society : Apr 2003, Paris, France.

(PV ; 2003-13)

Call No. (NDL): M17-04-2092
Bibliographic ID of National Diet Library: 000007340136

Material type: 図書

Author: Mathad, G. S.ほか

Publisher: Electrochemical Society

Publication date: c2003.

Material Format: Paper

Capacity, size, etc.: x, 424 p. : ill. ; 24 cm.

NDC: -

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Notes on use

Note (General)：: Papers."This proceedings volume contains the papers presented at the International Symposium on Thin Film Materials, Processes, and Reliability: Plasm...

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Paper

Material Type: 図書
ISBN: 1566773938
Title: Thin film materials, processes, and reliability : plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. : 203rd meeting of the Electrochemical Society : Apr 2003, Paris, France.
Series Title: PV ; 2003-13
Title Heading: Proceedings (Electrochemical Society) ; v. 2003-13.
Author Heading: Mathad, G. S.
International Symposium on Thin Film Materials, Processes, andReliability: PLasma Processing for the 100 nm Node and Copper Interconnects with Low-k Inter Level Dielectric Films (2003 : Paris, France)
Publication, Distribution, etc.: Pennington : Electrochemical Society
Publication Date: c2003.
Publication Date (W3CDTF): 2003
Extent: x, 424 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Thin films -- Congresses.
NDLC: M17
Note (General): Papers.
"This proceedings volume contains the papers presented at the International Symposium on Thin Film Materials, Processes, and Reliability: Plasma Processing for the 100 nm node and Copper Interconnects with Low-k Inter Level Dielectric Films. The symposium, (...) was held as part of the 203rd Meeting of The Electrochemical Society, Inc., in Paris, France, April 27-May 2, 2003." -- p. iii.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-04-2092
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000007340136
http://id.ndl.go.jp/bib/000007340136
LC Control Number: 2003109518
https://lccn.loc.gov/2003109518
RLIN No.: CSUGA5563776-B
Bibliographic Record Category (NDL): 215