Advances in electronic packaging : -- 2005 -- : proceedings of the ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : presented at 2005 ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : July 17-22, 2005 : San Francisco, California USA. : ASME InterPACK conference : IPACK2005 : 2005 summer heat transfer conference : Jul 2005, San Francisco, CA.

• 資料種別: 図書
• ISBN（セット）: 0791842002 (set)
• タイトル: Advances in electronic packaging : -- 2005 -- : proceedings of the ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : presented at 2005 ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : July 17-22, 2005 : San Francisco, California USA. : ASME InterPACK conference : IPACK2005 : 2005 summer heat transfer conference : Jul 2005, San Francisco, CA.
• 著者標目: ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 : San Francisco, Calif.)
• 出版事項: New York : ASME
• 出版年月日等: c2005.
• 出版年（W3CDTF）: 2005
• 数量: 3 parts : ill. ; 28 cm.
• 並列タイトル等: INTERPACK2005
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Electronic packaging -- Congresses.
• NDLC: M17
• 一般注記: Papers.
• 書誌注記: Includes bibliographical references and author index.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-06-647
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000008075907; http://id.ndl.go.jp/bib/000008075907
• RLIN番号: CSUGA6284126-B
• 整理区分コード: 215

• 内容細目: Pt. A: Thermal management of electronic and photonic systems : (...) : airborne, space and defense electronic packagingPt. B: Packaging of electronic ...