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図書

Advances in electronic packaging : -- 2005 -- : proceedings of the ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : presented at 2005 ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : July 17-22, 2005 : San Francisco, California USA. : ASME InterPACK conference : IPACK2005 : 2005 summer heat transfer conference : Jul 2005, San Francisco, CA.

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Advances in electronic packaging : -- 2005 -- : proceedings of the ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : presented at 2005 ASME/Pacific rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : July 17-22, 2005 : San Francisco, California USA. : ASME InterPACK conference : IPACK2005 : 2005 summer heat transfer conference : Jul 2005, San Francisco, CA.

Call No. (NDL)
M17-06-647
Bibliographic ID of National Diet Library
000008075907
Material type
図書
Author
ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2005 : San Francisco, Calif.)
Publisher
ASME
Publication date
c2005.
Material Format
Paper
Capacity, size, etc.
3 parts : ill. ; 28 cm.
NDC
-
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Notes on use

Note (General):

Papers.

Detailed bibliographic record

Contents:

Pt. A: Thermal management of electronic and photonic systems : (...) : airborne, space and defense electronic packagingPt. B: Packaging of electronic ...

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Bibliographic Record

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Paper

Material Type
図書
ISBN (set)
0791842002 (set)
Publication, Distribution, etc.
Publication Date
c2005.
Publication Date (W3CDTF)
2005
Extent
3 parts : ill. ; 28 cm.
Alternative Title
INTERPACK2005
Place of Publication (Country Code)
US