Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems -- 2005 : (...) : presented at 2005 ASME international mechanical engineering congress and exposition : November 5-11, 2005 : Orlando, Florida USA. : Nov 2005, Orlando, FL.
(EPP ; 5)
国立国会図書館請求記号
M17-06-1093
国立国会図書館書誌ID
000008160574
資料種別
図書
著者
International Mechanical Engineering Congress and Exposition (2005 : Orlando, Fla.)