図書

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems -- 2005 : (...) : presented at 2005 ASME international mechanical engineering congress and exposition : November 5-11, 2005 : Orlando, Florida USA. : Nov 2005, Orlando, FL. (EPP ; 5)

Icons representing 図書

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems -- 2005 : (...) : presented at 2005 ASME international mechanical engineering congress and exposition : November 5-11, 2005 : Orlando, Florida USA. : Nov 2005, Orlando, FL.

(EPP ; 5)

Call No. (NDL)
M17-06-1093
Bibliographic ID of National Diet Library
000008160574
Material type
図書
Author
International Mechanical Engineering Congress and Exposition (2005 : Orlando, Fla.)
Publisher
ASME
Publication date
c2005.
Material Format
Paper
Capacity, size, etc.
xviii, 606 p. : ill. ; 28 cm.
NDC
-
View All

Notes on use

Note (General):

Papers.

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type
図書
ISBN
0791842177
Series Title
Publication, Distribution, etc.
Publication Date
c2005.
Publication Date (W3CDTF)
2005
Extent
xviii, 606 p. : ill. ; 28 cm.