Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA.

• 資料種別: 図書
• ISBN（エラーコード）: 9781558998705
• タイトル: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA.
• シリーズタイトル: Materials Research Society Symposia Proceedings ; 914
• タイトル標目: Materials Research Society symposia proceedings ; v. 914.
• 著者標目: Tsui, Ting Y.; Materials Research Society. Meeting (2006 : San Francisco, Calif.); Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 : San Francisco, Calif.)
• 出版事項: Warrendale : Materials Research Society
• 出版年月日等: c2006.
• 出版年（W3CDTF）: 2006
• 数量: xvii, 462 p. : ill. ; 24 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Semiconductors -- Materials -- Congresses.; Semiconductors -- Junctions -- Congresses.; Dielectric films -- Congresses.; Integrated circuits -- Materials -- Congresses.; Integrated circuits -- Reliability -- Congresses.
• NDLC: M17
• 一般注記: Papers.
• 書誌注記: Includes bibliographical references and indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-06-2842
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000008355076; http://id.ndl.go.jp/bib/000008355076
• RLIN番号: MNUGA004892342-B
• 整理区分コード: 215