Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 914)

Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA.

(Materials Research Society Symposia Proceedings ; 914)

Call No. (NDL): M17-06-2842
Bibliographic ID of National Diet Library: 000008355076

Material type: 図書

Author: Tsui, Ting Y.ほか

Publisher: Materials Research Society

Publication date: c2006.

Material Format: Paper

Capacity, size, etc.: xvii, 462 p. : ill. ; 24 cm.

NDC: -

Notes on use

Note (General)：: Papers.

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Paper

Material Type: 図書
ISBN (error code): 9781558998705
Title: Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. : symposium F, "materials, technology and reliability of low-k dielectrics and copper interconnects" : 2006 MRS spring meeting : Apr 2006, San Francisco, CA.
Series Title: Materials Research Society Symposia Proceedings ; 914
Title Heading: Materials Research Society symposia proceedings ; v. 914.
Author Heading: Tsui, Ting Y.
Materials Research Society. Meeting (2006 : San Francisco, Calif.)
Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" (2006 : San Francisco, Calif.)
Publication, Distribution, etc.: Warrendale : Materials Research Society
Publication Date: c2006.
Publication Date (W3CDTF): 2006
Extent: xvii, 462 p. : ill. ; 24 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Semiconductors -- Materials -- Congresses.
Semiconductors -- Junctions -- Congresses.
Dielectric films -- Congresses.
Integrated circuits -- Materials -- Congresses.
Integrated circuits -- Reliability -- Congresses.
NDLC: M17
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and indexes.
Holding library: 国立国会図書館
Call No.: M17-06-2842
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000008355076
http://id.ndl.go.jp/bib/000008355076
RLIN No.: MNUGA004892342-B
Bibliographic Record Category (NDL): 215