2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.

2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.

国立国会図書館請求記号: M17-07-1131
国立国会図書館書誌ID: 000008546479

資料種別: 図書

著者: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (12th : 2007 : Fremont, Calif.)

出版者: [IMIC Headquarters?]

出版年: [2007]

資料形態: 紙

ページ数・大きさ等: 483 p. : ill. ; 28 cm.

NDC: -

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資料に関する注記

一般注記：: Program and papers."CMP-MIC Catalog No. 07 IMIC-2000P."

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紙

資料種別: 図書
タイトル: 2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.
著者標目: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (12th : 2007 : Fremont, Calif.)
出版事項: [Tampa] : [IMIC Headquarters?]
出版年月日等: [2007]
出版年（W3CDTF）: 2007
数量: 483 p. : ill. ; 28 cm.
並列タイトル等: 2007 proceedings : 12th international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California
2007 proceedings chemical-mechanical polish (CMP) for ULSI multilevel interconnection conference : March 6-8, 2007 -- Fremont, CA
出版地（国名コード）: US
本文の言語コード: eng
件名標目: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.
Integrated circuits -- Very large scale integration -- Design and construction -- Congresses.
Grinding and polishing -- Congresses.
NDLC: M17
一般注記: Program and papers.
"CMP-MIC Catalog No. 07 IMIC-2000P."
書誌注記: Includes bibliographical references.
所蔵機関: 国立国会図書館
請求記号: M17-07-1131
連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
書誌ID（NDLBibID）: 000008546479
http://id.ndl.go.jp/bib/000008546479
OCLC番号: 124073220
https://www.worldcat.org/oclc/124073220
整理区分コード: 215