2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.

2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.

Call No. (NDL): M17-07-1131
Bibliographic ID of National Diet Library: 000008546479

Material type: 図書

Author: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (12th : 2007 : Fremont, Calif.)

Publisher: [IMIC Headquarters?]

Publication date: [2007]

Material Format: Paper

Capacity, size, etc.: 483 p. : ill. ; 28 cm.

NDC: -

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Note (General)：: Program and papers."CMP-MIC Catalog No. 07 IMIC-2000P."

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Paper

Material Type: 図書
Title: 2007 proceedings : twelfth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2007 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/07 : 12th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2007, Fremont, CA.
Author Heading: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (12th : 2007 : Fremont, Calif.)
Publication, Distribution, etc.: [Tampa] : [IMIC Headquarters?]
Publication Date: [2007]
Publication Date (W3CDTF): 2007
Extent: 483 p. : ill. ; 28 cm.
Alternative Title: 2007 proceedings : 12th international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2007 Microelectronics Institute Inter-on-Chip Connection : March 6-8, 2007 : Fremont Marriott Hotel : Fremont, California
2007 proceedings chemical-mechanical polish (CMP) for ULSI multilevel interconnection conference : March 6-8, 2007 -- Fremont, CA
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.
Integrated circuits -- Very large scale integration -- Design and construction -- Congresses.
Grinding and polishing -- Congresses.
NDLC: M17
Note (General): Program and papers.
"CMP-MIC Catalog No. 07 IMIC-2000P."
Note (Bibliography): Includes bibliographical references.
Holding library: 国立国会図書館
Call No.: M17-07-1131
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000008546479
http://id.ndl.go.jp/bib/000008546479
OCLC No.: 124073220
https://www.worldcat.org/oclc/124073220
Bibliographic Record Category (NDL): 215